How to Open the Back of Xiaomi Phone: The Complete Guide

Modern Xiaomi brand smartphones and sub-brands Redmi and POCO often have a monolithic design, making the rear panel dismantling procedure a difficult task for the untrained user. Owners face the need to replace broken glass, battery or charging plume, but do not know how to open the Xiaomi lid without damage to the body. Wrong actions can lead to chipped faces, broken plumes or damaged moisture protection, so it is important to understand the physics of the gluing process.

The main adhesive in modern devices is a special thermoactive adhesive that softens only when heated to certain temperatures. Attempting to tamper with a cold tool is almost guaranteed to lead to glass destruction or deformation of the frame. In this article, we will discuss in detail the necessary tools, preparation steps and the process of removing the back cover on various models of smartphones.

Tools and workplace preparation required

Before you start dismantling, you need to organize a workspace that is well lit and free of unnecessary objects. You will need a set of specialized tools, since the use of kitchen knives or stationery blades is unacceptable because of the high risk of damage to the internal components. A quality tool minimizes the risk of slipping and provides control over the process.

To successfully complete the work on dismantling the back panel you will need:

• 🔥 Hair dryer (construction or household) for uniform heating of the perimeter of the body
• 🔪 Thin metal spatula or suction cup for primary edge lifting
• 🎸 Mediator or plastic cards for peeling glue around the perimeter
• 🧴 Isopropyl alcohol or special solvent of glue B-7000

Particular attention should be paid to the cleanliness of the surface: dust under the glass when reassembled can spoil the appearance of the device, and it is also recommended to use an antistatic mat to exclude the possibility of short circuit static electricity when touching the internal boards.

It is important to prepare the screw capacity in advance, since Xiaomi smartphones use fasteners of different lengths. By confusing them during assembly, you can damage the thread or punch the motherboard with the tip of a too long screw.

Features of the design of smartphones Xiaomi and Redmi

Xiaomi’s engineering solutions include different methods of attaching the back cover depending on the price segment of the model. In the budget devices of the Redmi series, a combination of plastic frames and glass or plastic rear panels glued around the perimeter is often found. Flagship models of the Mi and Xiaomi series more often use an all-metal frame and glass with a more aggressive adhesive layer.

The key difference is the location of the plumes connecting the main board with additional modules on the back cover. In some models, a fingerprint scanner or a main camera unit is glued to the inside of the glass, which requires special care when bending the panel. A sharp movement can lead to a plume break, the cost of replacing which can be comparable to repairing the entire device.

It is worth noting that the presence of IP68 moisture protection implies the use of a stronger and more elastic glue, which is more difficult to soften, and once such a device is opened, the leakage will be broken, and its restoration will require replacing the sealing frame and using professional glue.

The process of heating the case to soften the glue

Heating is a critical step that determines the success of the entire operation. The goal is to heat the adhesive layer around the perimeter without overheating the internal components, such as the battery or the display. The heating temperature is usually between 80 and 100 degrees Celsius, but it is difficult to control it without a thermoprofile, so you are time-sensitive and tactile.

Use a dryer to direct the flow of hot air strictly along the perimeter of the device, avoiding hitting the central part where the main nodes are located. Movements should be continuous and uniform to avoid local overheating, which can lead to yellow spots on the display or bloating of the battery.

⚠️ Warning: Never heat the area around the camera for too long, as optical stabilization and sensors can fail from thermal shock.

The heating process usually takes 3 to 5 minutes depending on the waxing power of the hair dryer and the thickness of the body. Periodically check the temperature by touching the surface with the back of the palm: if the hand is hot but tolerant, then the glue has reached the desired consistency. Insufficient heating will cause the lid to move away in jerks, breaking at the edges.

Technology of unplugging and removal of the back panel

Once the body is heated, you need to carefully break the tightness of the adhesive layer. This uses a suction cup that is installed at the bottom of the smartphone, or a thin metal blade that is inserted into the joint between the frame and the lid. If you use a blade, you should enter it into an existing micro-gap, often located near the charging connector or speaker.

Once the gap is minimal, a plastic mediator or a map is inserted into it, and the next step is to move the tool forward along the perimeter, cutting the softened glue, and the movements should be smooth, without jerking, and with constant monitoring of the depth of the instrument.

The main stages of removal of the cover:

• 📏 Introducing the tool into the gap at an angle of no more 15-20 degree
• ✂️ Progressive movement along the long side of the body
• 🔄 Repetition of the procedure for the opposite side and ends
• 👐 Careful lifting of the cover after complete passage of the perimeter

If you feel strong resistance, don't use force, it's a signal that the glue in the area is not warm enough or that the plume is passing through, and then you need to reheat the problem area with a hairdryer for 30-60 seconds.

Working with internal plumes and components

When you remove the back cover, you will be able to access the insides of the device, but you can’t rush to remove the battery or turn off the plumes. In many Xiaomi models, camera modules, flashes or fingerprint scanners can be glued to the back cover.

Carefully inspect the perimeter of the open case, if you see the strung plumes going from board to lid, they must be carefully deactivated, this uses a plastic blade or tweezers with a dielectric coating, metal tweezers are highly undesirable because of the risk of short circuit or damage to the connector.

Table of common locations of plumes on the lid depending on the model:

When the plumes are turned off, they need to bend before the plume is removed. The connector's clamping requires delicacy: excessive force breaks the plastic base of the connector on the board.

Cleaning the case and reverse assembly of the device

After successful dismantling and repairs (replacement of the battery, cleaning of the speakers), the surfaces must be prepared for reverse gluing, the old layer of glue must be completely removed from the shell and the cover itself, using isopropyl alcohol and a plastic blade.

The glue residues can be gently rolled into the coils, the surface should be perfectly smooth and clean, without villi and dust, if there are irregularities on the frame, they can be cleaned carefully with a small overfill, but you need to act extremely carefully so as not to damage the antenna inserts.

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Use lilac-free wipes moistened with alcohol to finally degrease the surface before applying new glue, which will ensure maximum adhesion and durability of the glue.

To fix the lid, you can use a special glue sealant (for example, B-7000 or T-7000) or a ready-made adhesive layer (frame) for a particular model. The adhesive is applied in a thin continuous line along the perimeter of the frame. After applying the lid, you must install it in place and press tightly along the entire perimeter.

⚠️ Warning: Excess glue from under the joints must be removed immediately before it freezes. The hardened glue is difficult to remove and can interfere with the installation of the protective cover or enter the connectors.

For high-quality polymerization of the glue, the device is recommended to be put under the press (for example, a stack of books) for 2-4 hours, pre-wrapped in a soft fabric for an even distribution of pressure. Complete drying takes about 24 hours, so on the first day it is better not to expose the smartphone to loads.

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The quality of cleaning the old glue directly affects how tightly the new lid will sit and whether it will luft or peel off in the pocket.

Frequently Asked Questions (FAQ)