Removing the back of the Xiaomi Redmi 8 is the first and perhaps most important step in any self-repair, and it is from this step that you start replacing a broken battery, repairing a charging socket or replacing a speaker. Many users are afraid to start disassembling, considering this process too difficult, but with the right tools and a clear understanding of the design of the device, the task becomes quite feasible.
The Redmi 8 design involves a plastic back cover that is attached to a two-part glue, which allows the manufacturer to reduce the weight of the device, but requires the wizard to be careful and patient. The challenge is to separate the panel from the body without damaging it and without affecting the internal plumes that can be glued to the lid itself. In this article, we will discuss all the nuances of the process.
Before you start physically affecting the body, you need to prepare the workplace, you need good lighting and a clean surface that does not lose small screws. Ignoring the preparation often leads to the fact that the fasteners are lost in the process of work or dust enters the speaker, which ultimately affects the sound quality.
To successfully perform the operation, you will need the following tools:
- 🔥 Hair dryer (construction or household) for heating the glue layer
- 🔥 Suction cup for careful pulling of glass or plastic
- 🔥 Mediator or plastic blade for snapping latches
- 🔥 Thin string or special line for cutting glue
Device preparation and security measures
The first step in any repair is to shut down the device completely. In the case of Redmi 8, you need to not just turn off the smartphone, but also make sure that it is not in charge or connected to the computer. This is a basic electrical safety rule, neglect of which can lead to a short circuit on the board.
Make sure to remove the tray for SIM-If you don't, the plastic of the tray can deform when you heat it, and the map can damage it, and the tray creates an additional stress point in the structure, which prevents the perimeter from warming evenly.
⚠️ Warning: Before starting work, remove all protective covers and films that can melt from the hot air of the hair dryer and stick to the body dead, which will require additional cleaning.
It is also important to take care of static electricity. Although modern smartphones have some protection, dry air and synthetic clothing can cause a discharge that can damage sensitive electronics: work on an antistatic mat or just periodically touch a grounded metal object.
💡
Warm up the body evenly, constantly moving the hair dryer around the perimeter. Do not keep the flow of hot air at one point for longer than 2-3 seconds, so as not to damage the display or internal components.
Technology of heating of adhesive layer
The glue holding the back cover of the Xiaomi Redmi 8 is an elastic mass that softens at around 80-90 degrees Celsius. Insufficient heating will cause you to break plastic latches or tear the lid itself instead of carefully detaching it. Too much heating is dangerous for the battery and the screen matrix.
Use a dryer to set the average temperature. Start warming up at the corners and perimeter of the device, paying special attention to the bottom, where the charging socket and speaker are usually located. The movements should be smooth and circular, covering the entire area of the connection.
The heating process usually takes 3 to 5 minutes depending on the power of your tool. Periodically check the temperature of the case by touching it with your hand - it should become hot, but not burning. If you use a building hair dryer, be extremely careful, as its temperature is much higher than the household temperature.
| Heat zone | Warm-up time | Temperature regime | Features |
|---|---|---|---|
| Upper end | 30-40 seconds | Medium. | Camera area and flashes |
| Side edges | 20-30 seconds | Medium. | Area of antenna inserts |
| Lower end | 40-50 sec. | Medium/High | The thickest layer of glue |
| Cover center | 10-15 sec. | Low. | Just to soften the center. |
Rear detachment process
Once the body is sufficiently warmed, you need to create an initial gap between the lid and the frame, which is the perfect suction cup. Attach it at the bottom of the back panel, closer to the center, but not at the very edge. Make a confident but smooth upward effort, while trying to insert a thin mediator or blade into the resulting gap.
If the suction cup doesn't work or you don't, you can use a thin string or line, you can apply it to the top corner (if there's a micro gap), or you can insert a thin blade to start the line, and you can cross-cut the ends of the line (sawing) and cut the layer of heated glue, which is the safest method for the integrity of the case.
Once the tool has entered the gap, start slowly leading it along the perimeter. Don't try to snap the lid off immediately. Your job is to layer the glue. Move from the center of the faces to the corners, controlling the depth of the tool's immersion so that you don't hit the plumes.
☑️ Stages of the lid separation
Working with internal components and plumes
When the adhesive is cut all over the perimeter, don't rush to tear the lid off. In the Redmi 8, a fingerprint sensor plume (if the modification suggests it is on the back) or other thin connections can be glued to the back, and a sharp movement is guaranteed to cause the plume to break.
Carefully lift the bottom of the lid and visually inspect the interior space. If you see connected components going to the panel, you need to turn them off first, and use tweezers or a plastic blade to hold the connector up.
Often, you have a speaker or a vibrator attached to the inside of the lid, and then the lid is removed with these modules, which is normal for this design, but it takes care to disassemble the main body further so that you don't drop the loose parts.
⚠️ Attention: The plumes in modern smartphones are very thin and fragile. Any tension or inflection at a sharp angle can disrupt their performance.
Cleaning of old glue and preparation for assembly
After the successful removal of the lid on the ends of the frame and on the panel itself, there will be remnants of the old adhesive composition. IP-protection) and the density of the fitting, the surface must be cleaned.
Do not use acetone or aggressive solvents, as they can damage the paint on the plastic frame or the structure of the plastic itself, making it cloudy.
If old glue is removed with difficulty, you can gently tuck it with a nail or a plastic card. Metal tools are best not used on visible parts of the case to avoid scratches. The cleanliness of the surface is the guarantee that the new glue will lie flat and will hold the lid securely.
How do you replace the factory glue?
Final assembly and inspection
Before applying a new layer of glue or pasting bilateral tape, it is recommended to check the health of all systems of the smartphone with the open lid. Connect the battery, turn on the device and check the sound, vibration, camera and fingerprint sensor, which will save you time in case something was touched during the dismantling process.
Apply a thin layer of glue around the perimeter of the frame or stick a special adhesive tape, previously removing the protective layer. Combine the lid with the body, starting at the top, and press tightly around the perimeter. For better fixation, you can use stationery rubber bands, pulling them together the phone for 15-20 minutes.
After assembly, make sure there are no gaps between the lid and the frame. If the lid is not tightly attached, you may have applied too much glue or not cleaned the surface well, in which case it is better to redo it immediately than wait for it to dry out.
💡
Quality cleaning of old glue and uniform application of new adhesive is 90% of the success in restoring the tightness and appearance of the smartphone after repair.