Xiaomi smartphones are known for their value for money, but even they are not immune to hardware breakdowns (eMMC/UFS). If the phone doesnβt turn on, hangs on the logo or makes an error E:MMC Read Failed, the problem may lie in the storage chips. Memory soldering is an extreme measure that is resorted to when other recovery methods (firmware, reset) do not help.
Self-sweetening requires not only special tools, but also experience with microelectronics, and errors here can lead to irreversible damage to the motherboard, so without soldering skills. BGA-But if you're going to do it yourself, this article will help you understand the nuances of the diagnostics, the selection of donor memory and the soldering process.
Signs of memory failure on Xiaomi
Before you take on the soldering iron, make sure that the problem is really in memory. Symptoms can overlap with other malfunctions (for example, damage to the processor or firmware), so it is important to conduct a diagnosis.
Main signs of breakdown eMMC/UFS-storage:
- π± The phone does not turn on, but the screen lights up or vibrates.
- π Hanging on the Mi logo or cyclic reboot (bootloop).
- β οΈ Errors in Fastboot or EDL-mode: SLA Auth Error, Flash Write Failed.
- ποΈ Recovery has a message in E: Can't mount. /data.
- π§ When connected to a PC, the phone is not defined as a drive (even in Fastboot).
If the smartphone is even partially powered on, try checking the memory through the engineering menu.
- Go to dial mode and type ##4636##.
- Select Testing β Memory.
- Please note the internal story and SD Card (if any).
β οΈ Note: If the phone is making an error E:MMC Read Failed when trying to flash through Fastboot, it's almost guaranteed to indicate hardware memory failure.
Xiaomi models are more likely to suffer from memory problems
Some Xiaomi series of smartphones are more prone to memory failures due to savings on components or design features.
| Model | Type of memory | Frequent problems | Reason. |
|---|---|---|---|
| Redmi Note 4/4X (mido) | eMMC 5.1 | Data loss, bootloop | Cheap chips Samsung/Kioxia, overheating |
| Redmi 5/5 Plus (rosy/vince) | eMMC 5.1 | Recording errors, slow work | Poor quality rations |
| POCO F1 (beryllium) | UFS 2.1 | Contact dump, E:MMC Read Failed | Overheating due to weak cooling system |
| Mi 8/8 SE (dipper/sirius) | UFS 2.1 | Loss of section /data | Oxidation of contacts after moisture |
Smartphones on UFS-memory, for example, POCO X3 Pro, Redmi K40) less likely to fail, but their repair is more difficult due to multichannel architecture. eMMC (in budget models) often suffers from the "dump" of contacts, but it is easier to sell over.
If your model isn't on the list, it doesn't mean it's reliable.
- π₯ Overheating (games, charging) + load).
- β‘ Voltage surges (non-original RMS).
- π§ Moisture infestations (even after drying).
- π οΈ Unsuccessful firmware (interrupted recording process).
Tools and materials for soldering
You need professional equipment to sell your memory, you can't save on tools, because a cheap soldering iron or a heat air can damage the board.
- π§ Thermo-air station (e.g. Quicko) T12 Lukey. 858D+) temperature-adjusted.
- π₯ A soldering iron with a thin sting (0.2β0.4 mm) for working with small contacts.
- π§² Magnetic holder for fixing the board.
- π Microscope or magnifying glass (magnification) Γ10βΓ20) for rations control.
- π§΄ Flus (e.g. Amtech) NC-559 or RMA-223).
- π§ Thermopaste for cooling neighboring components.
- π Power supply 3.3V/5V post-soldier.
- π¦ Donor memory (must match model and capacity).
You will also need consumables:
- π§΅ Capton tape to protect neighboring elements.
- π§½ Isopropyl alcohol (99%) for board cleaning.
- π¨ Scalpel or knife to remove old solder.
- π Template for BGA (If you plan to use a stencil).
β οΈ Note: Do not use lead-tin solder for BGA-Memory is only leadless (for example, SAC305). Lead can damage contacts due to melting point.
βοΈ Preparation of the workplace
Step-by-step instructions for soldering memory
The soldering process consists of several steps: dismantling the old chip, preparing the board, installing a new memory and testing. Let's take each step in detail.
1. Dismantling the old chip
First, you need to carefully remove the old memory without damaging the contact platforms on the board:
- Secure the fee in the holder, the memory contacts up.
- Cover the adjacent components with a captone tape.
- Apply the flux to the edges of the chip.
- Warm up your memory with heat air to 300-350Β°C, evenly watering the nozzle.
- When solder melts, gently tuck the chip with a scalpel or tweezers.
If the memory is not going away, do not apply force - it is better to repeat the heating. The main thing is not to overheat the board: the maximum temperature for most Xiaomi is 380.Β°C.
Clearing contact areas
After dismantling, the board will have solder droplets and flux, and they need to be removed:
- Wet the brush in isopropyl alcohol and clean the pads.
- If necessary, use a braid for soldering or copper wire to remove excess solder.
- Check the integrity of the tracks under a microscope, and if there are breaks, they need to be rebuilt with lintels.
3. Installation of new memory
Before soldering the new chip:
- Compare the markings of old and new memory β they should match the model (for example, the same memory, KLMAG2JENB-B041 For the Redmi Note 4).
- Apply a fresh flux to the contacts of the new chip.
- Carefully install it in place, combining it with the platforms.
- Heat up with heat air to 280-320Β°C, until the chip is "sitting down.
Do not move the board until it is completely cooled (5-10 minutes). After soldering, clean again with alcohol and check the quality of contacts under the microscope.
4. Testing
Connect the board to the power supply unit 3.3V (through PMIC) and check:
- π Does the memory heat up (should be slightly warm, not hot).
- π± Is the phone defined in Fastboot (fastboot devices).
- ποΈ Are the memory sections visible in EDL-Mode (via QFil or Mi Flash).
If the phone is not turned on, check:
- Quality of soldering (possible cold contacts).
- Integrity of Processor Tracks (SoC).
- Stress on the memory supply line (VCC_MMC, usually 1.8V or 3.3V).
π‘
If after soldering the phone turns on, but does not see SIM-Wi-Fi or cards, you may be overheated. RF-tract (antenna modules) In this case, diagnostics will be required using the DC Power Supply and Oscilloscope.
Where to get a donor memory and how to choose it
The new memory chip must be completely identical to the old one:
- π Chip models (e.g, H9HKNNN4JDMMPR-NEM For the Redmi Note 8 Pro).
- ποΈ Capacity (32GB, 64GB, 128GB).
- π§ Interface type (eMMC 5.1, UFS 2.1. etc.).
Sources of donor memory:
- π AliExpress or eBay - sellers often indicate compatibility with Xiaomi models.
- π Donor boards β you can buy a broken phone of the same model on Avito or Yule.
- π Service centers β sometimes sell used chips after repair.
- π¦ Renovation kits (for example, from REDRAGON or iFixit).
Before buying, check:
- π Data code on the chip (must match or be newer).
- π Seller Certificates (on AliExpress, see ratings and reviews).
- π° The price is too cheap a memory (below). $(10) is often a forgery.
β οΈ Note: If you use the memory from the donor board, make sure it has not been damaged. You can check this by testing the donor phone before dismantling (for example, via Fastboot).
How do you detect a fake memory?
Frequent Mistakes and How to Avoid Them
Even experienced craftsmen sometimes make mistakes when soldering.
| Mistake. | Reason. | How to avoid |
|---|---|---|
| Fees are not included after rationing | Short circuit or cold contacts | Check the multimeter for KZ before switching on |
| The phone is switched on but does not see memory | Chip model mismatch or track damage | Verify the marking and check the chain CLK, CMD, DAT0-DAT7 |
| Overheating of the processor after repair | Damage to the heatpaste or radiator | After soldering, apply a new thermal paste and check the cooling |
| Reading/write errors | Poor contact or site oxidation | Clean with alcohol and use high-quality flux |
Other typical problems:
- π₯ Overheating the board, it detaches the tracks, so the solution is to use the heat paste to protect the adjacent components.
- π§² Magnetic interference can damage data on new memory. Solution: work away from magnets.
- π§ Corrosion - if the board was in water, before soldering it must be cleaned with ultrasound.
If the phone is unstable after repair (for example, spontaneously restarts), the reason may be:
- Poor quality rationing of feed lines (VCC_MMC, VCCQ_MMC).
- Damage to the memory controller in the processor (replacement of the SoC is required).
- Incompatibility of firmware with new memory (you need to flash the stock version) MIUI).
π‘
If the phone turns on after the soldering, but it gives an error E:Invalid partition table, it means that the new memory is empty. EDL with the Mi Flash Pro.
Alternatives to squashing: when you can do without it
Memory soldering is a last resort, and in some cases, the problem can be solved by software or less radical methods:
- π Firmware in EDL-If the memory is detected but not working correctly, try flashing the full image through Qualcomm HS-USB QDLoader 9008.
- ποΈ Reinstatement of the section /data β If the phone is turned on but does not see user data, the command will help: fastboot erase userdata fastboot flash userdata userdata.img
- π§ Replacement of motherboard β if the memory fails along with other components, it is cheaper to buy a used board on Avito.
- π± Using a phone without internal memory β some models (Redmi) 4X, Redmi 5A) They can work with external SD-card as with the main drive (you need a root and a patch vold.fstab).
If you are not sure about the cause of the breakdown, try the following steps:
- Connect your phone to your PC and check if it is detected in Device Manager (even as a device). QHSUSB_BULK).
- Try to log in to Fastboot (Power) + Vol Down) and execute: fastboot getvar all If there is a line in the output mmc0: error, the problem is exactly in memory.
- Check the voltage on the contacts of the memory with a multimeter (should be) 1.8V or 3.3V model-wise).
If none of the methods worked, there is only a soldering or replacement of the fee.