Modern smartphones, including the popular Xiaomi Redmi 8, are designed to be monolithic, making it difficult to access internal components. The back is not just a decorative element, but an important part of the structure that provides stiffness and protection from dust. However, if the screen is broken or a battery replacement is required, the owner inevitably faces the question of how to remove this element carefully without damage.
The procedure for opening the case requires some preparation and the presence of a specialized tool, since the manufacturer uses a strong adhesive composition to fix the parts. Sloppy actions can lead to cracks in the glass or damage to the plumes, so the process should be approached as responsibly and coolly as possible. In this article, we will discuss in detail all the stages of work, the necessary tools and technical nuances that will help you avoid fatal errors during repairs.
Before you start physically affecting the body, you need to make sure that the device is completely turned off and the battery is not in a critical discharge or, conversely, full charge, which increases the risk of fire if damaged. The Redmi 8 back cover is made of polycarbonate, but it is glued around the perimeter, not fixed screws, as in older phones. Understanding this feature is key to successfully starting repairs.
Tools and workplace preparation required
For a high-quality and safe disassembly of the Xiaomi Redmi 8, you will need a minimal but specific set of tools that can be found in any radio parts store or ordered online. Lack of suitable equipment often leads to amateur masters scratching the body with metal objects or breaking glass with excessive effort.
First of all, you need a heat source. The glue that holds the back cover is thermoactive, which means softening its structure when heated to certain temperatures. Using a regular household hair dryer is often not effective enough because it does not give the desired concentration of heat at the point of impact. Professional thermophenes or, in extreme cases, heating platforms (separators) are best proven.
In addition to heating, suction cups and mediators are critical, suction cups allow the initial gap between the body and the lid, and thin plastic blades (mediators) are needed to further trim the adhesive layer. Metal tools are strongly discouraged, as they can damage the battery or shorten contacts on the board.
- π₯ Thermophen or heating pad for uniform heating of the perimeter of the body.
- π³ Thin plastic card or special mediator for cutting glue.
- π Suction cup with reliable fixing mechanism to create initial gap.
- 𧀠Dielectric gloves to protect against static electricity and greasy traces.
β οΈ Note: Before starting the work, be sure to remove SIM-card and memory card, if installed.Heating a device with a memory card installed can cause it to be damaged or data lost.
The process of heating and creating the initial gap
The most critical step in the success of the entire operation is to heat the perimeter of the device correctly. Xiaomi Redmi 8 has rounded edges, which requires uniform distribution of heat throughout the connection area of the glass and frame. Insufficient heating will lead to the fact that the glue will not soften, and you risk splitting the back panel when you try to separate it.
Turn on the thermophen and set the temperature in the range of 80-100 degrees Celsius. Keep the tool at a distance of 3-5 centimeters from the surface of the phone, constantly moving the jet of hot air along all four sides of the device. Do not hold the hair dryer at one point for too long, so as not to overheat the display or battery located directly under the heated area. The entire process of primary warming up usually takes from 2 to 4 minutes depending on the power of the equipment.
Once the body is warmed up, quickly but carefully install the suction cup at the bottom of the back cover, closer to the logo, but not at the very edge. Pull the suction cup up, creating tension, and insert a thin mediator or a safety knife blade into the resulting microscopic gap. If the gap does not form the first time, the heating procedure must be repeated.
It's important to understand that the adhesive layer can behave differently depending on whether the phone has been opened before. The factory glue always holds stronger than the repair glue, so it may take longer to heat up for the first opening. Be prepared for the fact that it will take several cycles of "heat-try-open".
Technique of cutting the adhesive layer along the perimeter
Once you've managed to insert the mediator into the gap, the painstaking work of cutting the glue begins. Move the plastic blade along the edge of the case, trying to keep it parallel to the plane of the rear cover. Xiaomi Redmi 8 has a fairly thin bezels, so the depth of the tool should not exceed 2-3 millimeters, so as not to touch the internal components.
Move slowly, feeling resistance. If the mediator stops walking, it's a signal that the glue in this area is still hard. Don't use force! Take the tool out, warm the problem area again with a hairdryer for 30-40 seconds and continue working. Sharp movements can cause the lid to burst in your hands.
Pay special attention to the corners of the device. It's in these areas that the adhesive layer is often thicker, and the geometry of the body is more complicated. It's convenient to use the angle of the mediator or a special thin knife to trim the glue, but you need to act with jewelry precision. Go around the perimeter until the lid starts to walk freely in your hands.
- π Move around in a circle, gradually deepening, rather than trying to peel off one side completely at once.
- π‘οΈ When you feel strong resistance, stop pulling and add heat immediately.
- π‘οΈ Make sure that the mediator blade does not slip inside the case on the motherboard.
β οΈ Attention: At the top of the smartphone, next to the camera module, is a fingerprint scanner plume (in some versions) or other ΨΨ³connects. Be careful when dipping the tool into the top of the body.
Disabling plumes and removing the decorative panel
When the adhesive layer is completely trimmed, don't rush to rip the lid off abruptly. Inside the case, there may be thin connecting plumes that link the back panel to the main board. In the Redmi 8 model, it's common to see a situation where an antenna module or flash LED can be fixed to the inside of the lid.
Carefully lift the lid and carefully inspect the interior space in good lighting. If you see thin flat cables running from lid to board, they need to be turned off. Use a plastic blade or dielectric-coated tweezers. Connector latches are very fragile, they are easy to break when carelessly jerked.
The process of disconnecting the connector usually involves easily bending the lock up, after which the plume is freely removed from the connector. If the plumes are not detected (which is most often the case in this model, since the antennas are often integrated into the body), you can completely remove the back cover and put it in a safe place, putting a soft cloth under the bottom.
Now you have access to the battery, the motherboard, and other components, but if the goal was to remove the lid, that's the main stage, and you're going to need a new adhesive to build it back, because the old one has lost its properties.
What to do if the plume is broken?
Replacement of glue and reverse assembly of the body
Installing a new back cover requires surfaces to be cleaned first, the old glue must be carefully removed from the frame and from the lid itself, using isopropyl alcohol and plastic scraper. The residues of the old glue will create irregularities, and the new panel will get crooked, causing cracks and dust to enter the device.
For fixation, use a special glue B-7000 or E-8000, or a pre-prepared adhesive frame (adhesive), cut exactly in the shape of Xiaomi Redmi 8. The adhesive frame is preferable, since it has the same thickness around the perimeter and provides better tightness. Apply a thin layer of glue on the low-fat frame surface, avoiding the composition entering the speakers and microphone holes.
Carefully align the lid with the body, starting at the top where the camera is located. Make sure all the holes match, and press the panel tightly around the perimeter. To evenly distribute the pressure, you can use rubber harnesses or special clips, leaving the phone in this position for 1-2 hours until the glue is completely polymerized.
| Materials | Drying time | Elasticity | Difficulty in removal |
|---|---|---|---|
| B-7000 (liquid) | 24 hours (full) | Tall. | Medium |
| Glue frame | 1-2 hours | Medium | Low. |
| Superglue (cyanacrylate) | 5-10 minutes | Absent. | Very high. |
β οΈ Warning: Never use household superglue (cyanacrylate glue) to fix the smartphone cover! it becomes hard as glass, cannot be reheated and can damage the plastic of the case when you try the next repair.
Frequent errors and precautions
Many users, in their attempt to save money on service centers, make a number of common mistakes that make simple repairs costly, the most common being rushing, and the unheated glue breaks rather than cuts, putting force on the glass of the lid, which leads to its destruction.
Another mistake is using metal tools without insulation. Accidental touching of the motherboard with a metal blade can cause a short circuit even if the phone is turned off (residual current in the capacitors). Always use a quality dielectric coated tool.
Static electricity is also important to remember: In dry rooms, especially in winter, a static charge can accumulate on a person's clothes and body, which is dangerous for microelectronics. Before working, touch a grounded metal object or use an antistatic bracelet.
- β Do not try to cover the lid with a knife without prior heating.
- β Avoid getting glue. B-7000 camera-to-lens.
- β Do not turn on the phone immediately after assembly, let the glue grab at least 30 minutes.
βοΈ Preparation for assembly
π‘
Use paint tape to lock the lid around the perimeter for the first 15 minutes after gluing, which will prevent it from slipping until the glue thickens.
π‘
The main secret of success is patience and high-quality heating. 90% of failures are associated with an attempt to open a cold or poorly heated case.